Global Wafers released its June financial report on July 8th, with a combined revenue of NT $5.34 billion (the same below), a month on month increase of 2.66% and a year-on-year decrease of 15.32% from June last year. GlobalWafers achieved a combined revenue of 15.33 billion yuan in the second quarter of this year, an increase of 1.58% compared to the first quarter and a decrease of 14.36% compared to the same period last year.
In the first half of 2024, GlobalWafers accumulated consolidated revenue of 30.41 billion yuan, a decrease of 16.71% compared to the same period last year.
Against the backdrop of the global wave of artificial intelligence (AI), the demand for high bandwidth memory (HBM) in the market has significantly increased. Advanced processes and CoWoS packaging technology are expected to continue to drive growth in semiconductor wafer usage. GlobalWafers is cautiously optimistic about future revenue growth.
At the shareholder meeting in June, Xu Xiulan, Chairman of GlobalWafers, stated that the second half of the year would be better than the first half, but due to slower than expected customer demand and smaller growth, she is optimistic that next year, with customer destocking completed and demand rebounding, operations will significantly increase, and there will be another wave of long-term contract signing demand.
From a single industry perspective, Xu Xiulan pointed out that the demand in the automotive, mobile phone, and industrial markets is weak, and the rebound in business will be slower than expected, failing to achieve a "V-shaped rebound" as originally expected.
