Recently, it was reported that Samsung Electronics' OEM business unit plans to hold a OEM and SAFE forum in Silicon Valley, USA from June 12th to 13th. At that time, its technology roadmap and plans to strengthen the OEM ecosystem will be announced. It is expected that Samsung will advance the 1nm process mass production plan originally scheduled for 2027 to 2026.
Previously, Samsung Electronics successfully produced 3nm wafer foundry for the first time globally in June 2022. Samsung plans to start mass production of its second generation 3nm process in 2024 and 2nm process in 2025. After renaming, Samsung may integrate second-generation 3nm and 2nm processes. It is speculated that Samsung may start mass production of 2nm chips as early as the second half of 2024.
TSMC plans to reach A16 node (1.6nm) by 2027. According to media reports, TSMC is expected to begin mass production of 1.4nm around 2027-2028.
In addition, TSMC expressed confidence in the 2nm process and stated that it will gain more customers than the 3nm process. On May 23rd, Zhang Xiaogang, Deputy General Manager of TSMC Process Development, stated at a forum that "the development of the 2nm process is progressing smoothly" and "mass production can be achieved around 2025 as planned", refuting speculation that "TSMC will postpone full mass production of the 2nm process to 2026 due to technical issues".
The rumor of TSMC delaying the 2nm process originated from the first application of a current control technology called Gate All Around (GAA). Samsung Electronics introduced this technology in its 3nm process in June 2022, which can reduce the leakage current of transistors and improve the power efficiency of chips.
TSMC's confidence stems from its close relationship with its major customer, Apple, which accounts for 25% -30% of TSMC's revenue. There are reports that Apple COO Jeff Williams secretly visited Taiwan around May 20th to discuss a 2nm cooperation plan with the CEO of Wei Zhejia.
