According to reports, TSMC is expected to receive the first batch of the world's most advanced chip manufacturing machines from Dutch supplier ASML by the end of this year, only a few months later than its American competitor Intel.
They are known as High NA EUV lithography machines and are the most expensive chip manufacturing equipment in the world, with a price of approximately $350 million per unit. TSMC, Intel, and Samsung are currently the only global chip manufacturers still competing to produce smaller and more powerful semiconductor products, and they all heavily rely on ASML's equipment.
According to the source, TSMC will install a new High NA EUV lithography machine in its R&D center near its headquarters in Hsinchu, Taiwan, China, this quarter. Extensive research and engineering work is required before the new equipment can be used for large-scale chip production, but sources say TSMC believes there is no need to rush into action. "Based on current research and development results, there is no urgent need to use the latest version of the High NA EUV lithography machine, but TSMC does not rule out the opportunity to conduct comprehensive pathfinding and engineering work, and use the industry's most advanced equipment for trial runs. The company's goal is to retain all options
According to sources, TSMC may only consider using these machines for commercial production after launching A10 production technology, possibly after 2030. It is reported that A10 technology is about two generations higher than TSMC's planned 2nm technology to be put into production by the end of 2025.
TSMC confirmed that they will introduce these new devices, but did not disclose any specific details about delivery time or production. The company stated, "TSMC carefully evaluated technological innovations such as new transistor structures and new tools, and considered their maturity, cost, and benefits to customers before putting them into mass production. TSMC plans to first introduce High NA EUV lithography machines for research and development to develop the relevant infrastructure and pattern solutions needed by customers to drive innovation
In terms of ASML High NA EUV lithography machine adoption, Intel installed the first set of High NA EUV lithography machines at its R&D center in Oregon, USA in December 2023 and is currently conducting testing to prepare for commercial production. In the second quarter of this year, ASML's second set of High NA EUV lithography machines was shipped to Intel. Recently, there have been reports that Samsung Electronics is preparing to introduce its first High NA EUV lithography equipment in early 2025, marking Samsung's first foray into High NA EUV technology. Previously, the company had collaborated with IMEC on circuit processing research. Samsung plans to accelerate the development of advanced nodes using its own devices and has set a goal of commercializing 1.4nm processes by 2027, which may pave the way for 1nm production.
