SEMICON 2024 semiconductor exhibition held by SEMI in Taiwan, China, China will be launched from September 4, with more than 1100 manufacturers participating. Advanced packaging technologies such as CoWoS and panel level packaging will become the focus of the exhibition. Taiwan manufacturers such as TSMC, ASE, INNOLUX, as well as international giants such as AMD, Intel, Micron, Samsung Electronics and SK Hynix will share the new trend of advanced packaging heterogeneous integration technology.
SEMICON 2024, a semiconductor exhibition in Taiwan, China, China, will be held in Taipei Nangang Exhibition Hall from September 4 to 6. The sponsor SEMI estimates that this year's SEMICON exhibition will reach a new high, gathering more than 1100 manufacturers, using 3700 booths and more than 20 international forums.
SEMI expects over 200 industry leaders from the global high-tech and semiconductor fields to attend, with representatives from 56 countries/regions participating. During the exhibition, 12 countries/regions will also set up special zones for participation, with an estimated number of professional visitors exceeding 85000.
Among them, advanced packaging technology is regarded as the direction of technological development in the coming years. The International Forum on Advanced Packaging at this semiconductor exhibition covers the main technologies of semiconductor advanced packaging that are of global concern, including chiplets, 3D ICs, CoWoS, and panel level fanout packaging (FOPLP).
Major advanced packaging manufacturers actively participated in this SEMICON exhibition. The organizer stated that they have gathered over 40 CoWoS related manufacturers and over 40 panel level packaging manufacturers' supply chains, covering equipment, materials, components, and related processes.
At the Advanced Packaging International Forum, SEMI announced that TSMC and ASE Semiconductor are leading the way in holding the first 3D IC/CoWoS driven AI chip innovation forum to explore packaging heterogeneous integration technology and continue to deepen semiconductor development.
In addition, this year's SEMICON exhibition also held a panel level fanout packaging innovation forum for the first time, including Applied Materials ASE, INNOLUX, NXP, Xinxing Electronics, Manz, etc., which will share panel and fanout packaging technology, manufacturing progress, and future market conditions.
SEMI announced that a series of advanced packaging heterogeneous integration international forums, including AMD, Intel, Micron, Samsung Electronics and SK Hynix, Singapore Chiplet unicorn SiliconBox, Sony Semiconductor, and other overseas giants, will comprehensively explore and share key packaging technologies such as high bandwidth memory (HBM), silicon photonics, co packaged optical modules (CPO), and hybrid bonding over a period of 4 days.
For the first time, the SEMICON exhibition has also planned an AI semiconductor technology concept area, including ASE, Cadence, Heterogeneous Integrated System Level Packaging Alliance, Nvidia, Samsung Electronics, and Zhending, showcasing new research and development technologies and products in AI chip manufacturing, design, dedicated hardware, and integration services.
In addition, the first Silicon Photonics International Forum will explore the development potential of silicon photonics technology in AI driven data centers and cloud computing applications, with technical experts from TSMC, ASE, Broadcom, MediaTek, and YoleGroup sharing their insights.
