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Samsung Electro Mechanics upgrades key chip technology to create a glass substrate ecosystem


Samsung Electronics, a subsidiary of Samsung Group, is a key player in the field of semiconductor chip technology. It not only designs storage and logic chips, but also produces these chips for multiple other brands. The substrate is the foundation for manufacturing semiconductor chips, and Samsung Electro Mechanics, a subsidiary of Samsung Group, plans to upgrade its technology to meet future chip demands.

Samsung Electro Mechanics stated that it is building a glass substrate ecosystem for semiconductor chips, aiming to quickly solve related technical challenges and commercialize the technology.

Currently, plastic wafers are used as substrates for semiconductor chips and are expected to be replaced by glass substrates. Glass substrates have lower warpage, making it easier to achieve precise signal paths and improve performance. It can also print a large number of copper channels, thereby improving power efficiency. According to reports, compared to chips using plastic substrates, chips using glass substrates will have improved performance and reduced power consumption.

Recently, Joo Hyuk, Vice President of Samsung Electro Mechanics Research Institute, stated, "We plan to form alliances with multiple suppliers and technology partners to create an ecosystem for semiconductor glass substrates

Samsung Electro Mechanics will create an ecosystem covering equipment, materials, components, and process brands, and promote collaboration between them. Samsung Electro Mechanics has been in talks with relevant companies and the ecosystem is about to launch.

Samsung Electro Mechanics' factory production line in Sejong, South Korea is expected to launch a pilot project in the second quarter of this year and achieve mass production after 2027. This acceleration is the result of a surge in demand for artificial intelligence chips (AI).

According to reports, Samsung Electro Mechanics is in talks with Samsung Semiconductor, which is responsible for chip design (system wide integration circuits) and manufacturing (Samsung foundries), as well as other global chip companies including Intel, Nvidia, and Qualcomm.

Samsung Electro Mechanics targets both the glass intermediate layer (intermediate material) and glass core (main material) markets. In AI chips, glass chips connect GPUs with high bandwidth memory (HBM), such as AMD and Nvidia chips.

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