Recently, STMicroelectronics announced detailed information on its global manufacturing base restructuring plan. The plan aims to further enhance competitiveness, strengthen its position as a global semiconductor leader, and ensure its long-term sustainability as an IDM through the strategic assets of global technology research and development, design, and mass production.
Specifically, the company prioritizes investing in infrastructure prepared for the future, such as 300mm silicon wafer factories and 200mm SiC wafer factories, and expects these factories to reach significant scale. In addition, the company will also maximize the production capacity and efficiency of traditional 150mm silicon wafers and mature 200mm silicon wafers.
It is reported that STMicroelectronics will continue to utilize all existing bases and give some of them a redefined mission to support long-term success. While continuing to focus on sustainable development, the company will introduce artificial intelligence and automation technologies to further improve the efficiency of technology research and development, manufacturing, reliability, and certification processes, and invest in upgrading the technology used throughout the entire enterprise.
During the three-year manufacturing footprint reconstruction period from 2025 to 2027, STMicroelectronics plans to strengthen digital technology in France, analog and power technology in Italy, and mature process technology in Singapore. At the Agrate factory in Italy, the company plans to increase the production capacity of 300mm silicon wafers to 4000 pieces per week and expand it to 14000 pieces per week through modular expansion based on market conditions. In addition, with the increasing emphasis on 300mm silicon wafers, the factory's 200mm silicon wafer manufacturing facility will shift towards MEMS manufacturing.
RFQs/Order (0)