FIT0292-R

Request Quote

Please complete all required fields with your contact information.Click "SUBMIT RFQ" we will contact you shortly by email. Or Email us:info@ftcelectronics.com

Inquiry Online

Specifications

Part Number

FIT0292-R
Manufacturer/Brand

DFRobot
Stock Quantity

In stock
Description

FILAMENT RED PLA 0.07" 1KG
Lead Free Status / RoHS Status

Lead free / RoHS Compliant
Datasheets

FIT0292-R.pdf
ECAD Model
Weight

2.205 lb (1.00kg)
Tensile Strength

46Mpa
Series

-
Other Names

1738-1203
Operating Temperature

215°C ~ 225°C
Moisture Sensitivity Level (MSL)

1 (Unlimited)
Lead Free Status / RoHS Status

Lead free / RoHS Compliant
Flex Strength

70Mpa
Filament Material

PLA (Polylactide)
Filament Diameter

0.07" (1.75mm)
Features

-
Detailed Description

3D Printing Filament Red PLA (Polylactide) 0.07" (1.75mm) 2.205 lb (1.00kg)
Density

1.31g/cm³
Color

Red

Related News
Shipping
Payment

We have established long-term partnerships with major global logistics providers, offering flexible and efficient shipping solutions tailored to your unique needs. Depending on the size, weight, and destination of your order, we select the most suitable shipping carrier. We also provide real-time logistics tracking services, allowing customers to understand the location and status of their goods at any time.If you have specific international shipping routes or a designated freight forwarder, please contact our sales team—we are happy to accommodate your requirements.

We support multiple payment methods, including credit cards, wire transfers, and other options, and accept most currencies. For orders placed in USD, additional payment options are available. For more details on payment methods and procedures, please contact our sales team.

The following is "FIT0292-R" related products.

FIT0292-PE

Description: FILAMENT PURPLE PLA 0.07" 1KG

Manufacturers: DFRobot

In stock

FIT0292-R

Request Quote

Samsung's OEM business is hit again, AMD gives up adopt...

TI introduces latest innovations in edge AI, automotive and...

SEMI: Q1 global silicon wafer shipments increased by 2.2...

SEMI： Global semiconductor materials market revenue grows ...

TSMC's 2nm process defect density hits a new low, expec...

India invests $2.7 billion to boost local electronic compon...

CounterPoint： By 2024, the global shipment of CMOS image s...

TSMC's 2nm chip will be mass-produced in the second hal...

Strong demand for analog chips, Texas Instruments Q2 revenu...

INATRONICS 2025: Electronics & Component Industries

Institution: Apple's self-developed chip is expected to...

NEPCON 2025 Unveils Next-Gen Tech

Select Language

Current Language