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Home > Products > Fans, Thermal Management > Thermal - Pads, Sheets > HF115AC-0.0055-AC-58
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2541912HF115AC-0.0055-AC-58 ImageBergquist

HF115AC-0.0055-AC-58

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Reference Price(In US Dollars)

In stock
1+
$0.10
10+
$0.085
50+
$0.076
100+
$0.068
500+
$0.059
1000+
$0.044
5000+
$0.038
Inquiry Online
Specifications
  • Part Number
    HF115AC-0.0055-AC-58
  • Manufacturer/Brand
    Bergquist / Henkel
  • Stock Quantity
    In stock
  • Description
    THERM PAD 19.05MMX12.7MM W/ADH
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Datasheets
    HF115AC-0.0055-AC-58.pdf
  • ECAD Model
  • Usage
    TO-220
  • Type
    Pad, Sheet
  • Thickness
    0.0055" (0.140mm)
  • Thermal Resistivity
    0.35°C/W
  • Thermal Conductivity
    0.8 W/m-K
  • Shape
    Rectangular
  • Series
    Hi-Flow® 115-AC
  • Outline
    19.05mm x 12.70mm
  • Other Names
    BER168
    BG426642
    HF115AC-58
    HF115AC00055AC58
    HF115TAAC-58
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Material
    Phase Change Compound
  • Manufacturer Standard Lead Time
    2 Weeks
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Detailed Description
    Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side
  • Color
    Gray
  • Backing, Carrier
    Fiberglass
  • Adhesive
    Adhesive - One Side

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