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Home > Products > Power Supplies - Board Mount > Accessories > APA502-60-001
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APA502-60-001

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Reference Price(In US Dollars)

In stock
50+
$1.961
Inquiry Online
Specifications
  • Part Number
    APA502-60-001
  • Manufacturer/Brand
  • Stock Quantity
    In stock
  • Description
    PAD THERMAL SIZE60 FOR AMPSS MOD
  • Lead Free Status / RoHS Status
    Not applicable / Not applicable
  • Datasheets
  • Series
    AMPSS®
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Manufacturer Standard Lead Time
    12 Weeks
  • Lead Free Status / RoHS Status
    Not applicable / Not applicable
  • For Use With/Related Products
    AMPSS®
  • Accessory Type
    Thermal Pads
APA501-60-007

APA501-60-007

Description: HEATSINK (60)57.2X89X12MM LO PRO

Manufacturers: Astec America (Artesyn Embedded Technologies)
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APA501-60-006

Description: HEATSINK (60) 57.5X59X37MM HORZ

Manufacturers: Astec America (Artesyn Embedded Technologies)
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Description: HEATSINK (80) 115X59X37MM HORZ

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Description: HEATSINK (80) 115X59X22.5MM HORZ

Manufacturers: Astec America (Artesyn Embedded Technologies)
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APA504-00-001

Description: SOCKET SPRING(20-CONTROL/15-PWR)

Manufacturers: Astec America (Artesyn Embedded Technologies)
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APA600-BG456M

Description: IC FPGA 356 I/O 456BGA

Manufacturers: Microsemi
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APA600-BG456I

APA600-BG456I

Description: IC FPGA 356 I/O 456BGA

Manufacturers: Microsemi
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APA501-80-001

APA501-80-001

Description: HEATSINK (80) 115X59X15MM VERT

Manufacturers: Astec America (Artesyn Embedded Technologies)
In stock
APA503-00-001

APA503-00-001

Description: STUD MTG TAPPED FOR HEATSINK

Manufacturers: Astec America (Artesyn Embedded Technologies)
In stock
APA501-80-007

APA501-80-007

Description: HEATSINK (80)115.6X89X12MM LOPRO

Manufacturers: Astec America (Artesyn Embedded Technologies)
In stock
APA501-80-002

APA501-80-002

Description: HEATSINK (80) 115X59X15MM HORZ

Manufacturers: Astec America (Artesyn Embedded Technologies)
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APA503-00-008

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Description: STUD MTG SOLDER FOR HEATSINK LP

Manufacturers: Astec America (Artesyn Embedded Technologies)
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APA503-00-002

APA503-00-002

Description: STUD MTG SOLDER FOR HEATSINK

Manufacturers: Astec America (Artesyn Embedded Technologies)
In stock
APA502-80-001

APA502-80-001

Description: PAD THERMAL SIZE80 FOR AMPSS MOD

Manufacturers: Astec America (Artesyn Embedded Technologies)
In stock
APA600-BG456

APA600-BG456

Description: IC FPGA 356 I/O 456BGA

Manufacturers: Microsemi
In stock
APA600-BGG456

APA600-BGG456

Description: IC FPGA 356 I/O 456BGA

Manufacturers: Microsemi
In stock
APA501-80-005

APA501-80-005

Description: HEATSINK (80) 115X59X37MM VERT

Manufacturers: Astec America (Artesyn Embedded Technologies)
In stock
APA501-60-005

APA501-60-005

Description: HEATSINK (60) 57.5X59X37MM VERT

Manufacturers: Astec America (Artesyn Embedded Technologies)
In stock
APA503-00-007

APA503-00-007

Description: STUD MTG TAPPED FOR HEATSINK LP

Manufacturers: Astec America (Artesyn Embedded Technologies)
In stock
APA501-80-003

APA501-80-003

Description: HEATSINK (80) 115X59X22.5MM VERT

Manufacturers: Astec America (Artesyn Embedded Technologies)
In stock

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