For Visitors at Electronica 2024

Book your time now!

All it takes is a few clicks to reserve your place and get the booth ticket

Hall C5 Booth 220

Advance Registration

For Visitors at Electronica 2024
You’ re all sign up! Thank you for making an appointment!
We will send you the booth tickets by email once we have verified your reservation.
Home > Products > Fans, Thermal Management > Thermal - Heat Sinks > BDN16-3CB/A01
RFQs/Order (0)
English
English
1633921BDN16-3CB/A01 ImageCTS Electronic Components

BDN16-3CB/A01

Request Quote

Please complete all required fields with your contact information.Click "SUBMIT RFQ" we will contact you shortly by email. Or Email us:info@ftcelectronics.com

Reference Price(In US Dollars)

In stock
1+
$4.89
10+
$4.757
25+
$4.629
50+
$4.372
100+
$4.114
250+
$3.857
500+
$3.729
1000+
$3.343
Inquiry Online
Specifications
  • Part Number
    BDN16-3CB/A01
  • Manufacturer/Brand
    CTS Corporation
  • Stock Quantity
    In stock
  • Description
    HEATSINK CPU W/ADHESIVE 1.61"SQ
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Datasheets
    1.BDN16-3CB/A01.pdf
    2.BDN16-3CB/A01.pdf
  • Width
    1.610" (40.89mm)
  • Type
    Top Mount
  • Thermal Resistance @ Natural
    13.50°C/W
  • Thermal Resistance @ Forced Air Flow
    4.50°C/W @ 400 LFM
  • Shape
    Square, Pin Fins
  • Series
    BDN
  • Power Dissipation @ Temperature Rise
    -
  • Package Cooled
    Assorted (BGA, LGA, CPU, ASIC...)
  • Other Names
    294-1103
    BDN163CB/A01
    BDN163CBA01
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Material Finish
    Black Anodized
  • Material
    Aluminum
  • Manufacturer Standard Lead Time
    14 Weeks
  • Length
    1.610" (40.89mm)
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Height Off Base (Height of Fin)
    0.355" (9.02mm)
  • Diameter
    -
  • Detailed Description
    Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
  • Attachment Method
    Thermal Tape, Adhesive (Included)

Anthropic receives another $4 billion investment from Amazo...

November 23th, 2024

SEMI: IC sales increase by 12% in Q3, growth expected t...

November 22th, 2024

It is reported that KIOXIA will receive listing approval on...

November 21th, 2024

Tower Semiconductor's latest silicon optical platform h...

November 20th, 2024

The industry recovers slowly. The epitaxial supplier IQE co...

November 19th, 2024

Comprehensive analysis of inductance: basics, characteristi...

November 19th, 2024

The core value and future development trend of passive comp...

November 18th, 2024

Supplier: A large number of RTX 50 series GPU components wi...

November 18th, 2024

Taiwan, China Semiconductor's output value will grow by...

November 17th, 2024

Expanding production of OLED panels, LG Display will invest...

November 15th, 2024

Amazon increases efforts to create customized AI chips, red...

November 14th, 2024

PEGATRON's Q3 net profit was NT $4.296 billion, a quart...

November 13th, 2024
Shipping
Payment
The following is "BDN16-3CB/A01" related products.
BDN09-3CB

BDN09-3CB

Description: HEATSINK CPU .91" SQ

Manufacturers: CTS Electronic Components
In stock
RFQ
BDN12-5CB/A01

BDN12-5CB/A01

Description: HEATSINK CPU W/ADHESIVE 1.21"SQ

Manufacturers: CTS Electronic Components
In stock
RFQ
BDNF2000

BDNF2000

Description: SWITCH DISCONN NON-FUSE 2000A

Manufacturers: Bussmann (Eaton)
In stock
RFQ
BDN13-3CB/A01

BDN13-3CB/A01

Description: HEATSINK CPU W/ADHESIVE 1.31"SQ

Manufacturers: CTS Electronic Components
In stock
RFQ
BDNF175A4

BDNF175A4

Description: SWITCH NON-FUS 4POLE 175A

Manufacturers: Bussmann (Eaton)
In stock
RFQ
BDN09-3CB/A01

BDN09-3CB/A01

Description: HEATSINK CPU W/ADHESIVE .91"SQ

Manufacturers: CTS Electronic Components
In stock
RFQ
BDNF1200

BDNF1200

Description: SWITCH DISCONNCT 1200A 600V 3POS

Manufacturers: Bussmann (Eaton)
In stock
RFQ
BDNF1600

BDNF1600

Description: SWITCH DISCONN NON-FUSE 1600A

Manufacturers: Bussmann (Eaton)
In stock
RFQ
BDN18-6CB/A01

BDN18-6CB/A01

Description: HEATSINK CPU W/ADHESIVE 1.81"SQ

Manufacturers: CTS Electronic Components
In stock
RFQ
BDN14-3CB/A01

BDN14-3CB/A01

Description: HEATSINK CPU W/ADHESIVE 1.41"SQ

Manufacturers: CTS Electronic Components
In stock
RFQ
BDN17-3CB/A01

BDN17-3CB/A01

Description: HEATSINK CPU W/ADHESIVE 1.71"SQ

Manufacturers: CTS Electronic Components
In stock
RFQ
BDN18-3CB/A01

BDN18-3CB/A01

Description: HEATSINK CPU W/ADHESIVE 1.81"SQ

Manufacturers: CTS Electronic Components
In stock
RFQ
BDN15-3CB/A01

BDN15-3CB/A01

Description: HEATSINK CPU W/ADHESIVE 1.51"SQ

Manufacturers: CTS Electronic Components
In stock
RFQ
BDN12-3CB/A01

BDN12-3CB/A01

Description: HEATSINK CPU W/ADHESIVE 1.21"SQ

Manufacturers: CTS Electronic Components
In stock
RFQ
BDN10-3CB/A01

BDN10-3CB/A01

Description: HEATSINK CPU W/ADHESIVE 1.01"SQ

Manufacturers: CTS Electronic Components
In stock
RFQ
BDNF175A

BDNF175A

Description: SWITCH DISCONNECT 175A 1000V

Manufacturers: Bussmann (Eaton)
In stock
RFQ
BDN10-5CB/A01

BDN10-5CB/A01

Description: HEATSINK CPU W/ADHESIVE 1.01"SQ

Manufacturers: CTS Electronic Components
In stock
RFQ
BDN11-3CB/A01

BDN11-3CB/A01

Description: HEATSINK CPU W/ADHESIVE 1.11"SQ

Manufacturers: CTS Electronic Components
In stock
RFQ
BDNF12002

BDNF12002

Description: SWITCH DISCONNCT 1200A 600V 2POS

Manufacturers: Bussmann (Eaton)
In stock
RFQ
BDN4XN1

BDN4XN1

Description: BREATHER DRAIN

Manufacturers: Hammond Manufacturing
In stock
RFQ
As the only public open market distributor, we possess a unique combination of global access,manufacturing industry expertise, and proven quality. With this, we can create customized,end-to-end supply chain solutions for electronics components sourcing and inventory management.
Follow us
Terms & ConditionsInfringement PolicyRequest a quoteAbout usContact UsSite map

Select Language

Click on the space to exit

Current Language

Choose your country or region.