A2F060M3E-FG256

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Specifications

Part Number

A2F060M3E-FG256
Manufacturer/Brand

Microsemi
Stock Quantity

In stock
Description

IC FPGA 60K GATES 128KB 256FBGA
Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant
Datasheets

A2F060M3E-FG256.pdf
ECAD Model
Supplier Device Package

256-FPBGA (17x17)
Speed

80MHz
Series

SmartFusion®
RAM Size

16KB
Primary Attributes

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Peripherals

DMA, POR, WDT
Packaging

Tray
Package / Case

256-LBGA
Operating Temperature

0°C ~ 85°C (TJ)
Number of I/O

MCU - 26, FPGA - 66
Moisture Sensitivity Level (MSL)

3 (168 Hours)
Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant
Flash Size

128KB
Detailed Description

ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops 128KB 16KB 80MHz 256-FPBGA (17x17)
Core Processor

ARM® Cortex®-M3
Connectivity

EBI/EMI, I²C, SPI, UART/USART
Base Part Number

A2F060M3E
Architecture

MCU, FPGA

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Description: IC FPGA 60K GATES 128KB 256FBGA

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A2F060M3E-FG256

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