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Home > Products > Discrete Semiconductor Products > Transistors - FETs, MOSFETs - Single > EPC2019
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1751801EPC2019 ImageEPC

EPC2019

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Reference Price(In US Dollars)

In stock
1000+
$2.029
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Specifications
  • Part Number
    EPC2019
  • Manufacturer/Brand
  • Stock Quantity
    In stock
  • Description
    TRANS GAN 200V 8.5A BUMPED DIE
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Datasheets
  • ECAD Model
  • Vgs(th) (Max) @ Id
    2.5V @ 1.5mA
  • Vgs (Max)
    +6V, -4V
  • Technology
    GaNFET (Gallium Nitride)
  • Supplier Device Package
    Die
  • Series
    eGaN®
  • Rds On (Max) @ Id, Vgs
    50 mOhm @ 7A, 5V
  • Power Dissipation (Max)
    -
  • Packaging
    Tape & Reel (TR)
  • Package / Case
    Die
  • Other Names
    917-1087-2
  • Operating Temperature
    -40°C ~ 150°C (TJ)
  • Mounting Type
    Surface Mount
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Manufacturer Standard Lead Time
    12 Weeks
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Input Capacitance (Ciss) (Max) @ Vds
    270pF @ 100V
  • Gate Charge (Qg) (Max) @ Vgs
    2.5nC @ 5V
  • FET Type
    N-Channel
  • FET Feature
    -
  • Drive Voltage (Max Rds On, Min Rds On)
    5V
  • Drain to Source Voltage (Vdss)
    200V
  • Detailed Description
    N-Channel 200V 8.5A (Ta) Surface Mount Die
  • Current - Continuous Drain (Id) @ 25°C
    8.5A (Ta)
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Description: TRANS GAN 60V 60A BUMPED DIE

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Description: TRANS GAN 200V 8.5A BUMPED DIE

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